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Intel explains why its multi-die arrangement on a single substrate is better than AMD chiplets
25.03.2021 [13:21],
Alexey Razin

Intel’s event yesterday made it possible to make sure that the company’s specialists were able to create the Ponte Vecchio computing accelerator from 47 silicon cells, which contain a total of 100 billion transistors. The head of Intel urges not to confuse proprietary layout solutions with AMD chiplets, at the same time explaining why his company’s approach is better.

Image source: Intel

As noted, new Intel CEO Pat Gelsinger has urged not to use the term «chiplet» to refer to individual elements of the Ponte Vecchio. According to him, it is more correct to call each crystal a «tile», and the PC Gamer saw it necessary to explain what is the fundamental difference in the layout approaches of Intel and AMD.

The latter, according to the source, requires a rather wide bus to coordinate the operation of individual chiplets and implement data exchange between them, which hides the «transistor budget» and complicates the product layout. Intel in its layout techniques Foveros and EMIB uses rather short conductors that run perpendicular to the plane of the crystal in the first case and parallel in the second. Neighboring dies on such a substrate do not require any buffers or buses for matching. This allows you to increase the density of placement of elements on one area, and also facilitates the integration of dissimilar crystals made by different lithographic technologies and even by different companies.

As you know, monolithic crystals are quite expensive to manufacture. In the case of 14nm technology, this has played a cruel joke with Intel more than once. Delayed in mastering the 10-nm process technology, she was forced to produce more and more large enough 14-nm crystals, as a result, she no longer had enough available production capacity. Even with the creation of Rocket Lake processors, the need to limit the die area forced engineers to limit the number of processing cores to eight pieces, although the flagship models of the Comet Lake family of processors previously offered ten cores on one die. The move to new layout methods will allow Intel to avoid such restrictions in the future, although it is understandable that it will require additional costs and will not reach the mainstream products of the brand so soon.

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