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Xiaomi showed the insides of the affordable flagship Poco F3 — there is even a heat pipe
26.03.2021 [19:47],
Maxim Shevchenko

On Monday, Xiaomi unveiled a new near-flagship smartphone Poco F3, built on the Snapdragon 870 chipset. Now the company has shared on Twitter a video of the disassembly of the device showing its internal layout.

The video begins by removing the back panel of the device, after which a view of the internal layout of the smartphone opens. Interestingly, an additional microphone, flash LED and light sensor are mounted directly on the inner cover that covers the smartphone board.

Removing this cover reveals the main board of the device. It contains a Snapdragon 870 chipset combined with an LPDDR5 RAM module and a UFS 3 drive.one. There is a Wi-Fi 6 receiver nearby. These components on the board are covered by a metal heat-distributing cover.

It is curious that the sensors of the main camera are not combined into one unit. This allows you to easily replace each sensor separately, which reduces repair costs and increases the maintainability of the device.

By removing the board, cameras and battery, you can access the base of the smartphone. The frame is made of metal and contains a massive copper tube for the LiquidCool 1 cooling system.0 Plus, effectively cooling the device.

The video also showcases the smaller components of the device such as the dual-axis vibration motor, speakers, USB-C board, and more.

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