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Intel’s Progress in Mastering 7nm Process Technology Ensures Successful Implementation of EUV Lithography
Shortly after taking office as Intel CEO, Patrick Gelsinger announced that the company will be able to offer 7nm processors in the client segment in 2023, and that incremental improvements in lithography will be made annually from now on. In an interview with Bloomberg, the head of Intel also explained that the company’s progress in the development of EUV lithography allows us to count on this.
Image source: Bloomberg
Recall that this term means lithography with ultra-hard ultraviolet radiation, the wavelength of which allows you to create semiconductor components with reduced geometry with fewer technological passes and related tooling. Once EUV lithography is implemented in production, further work to reduce the size of the transistors will go smoother. Gelsinger admitted in an interview with Bloomberg that competitors like TSMC had already made progress in using EUV lithography while Intel hesitated to implement the 10nm process.
Six months ago, according to the head of Intel, the company’s specialists understood how to optimally apply EUV lithography in the production of 7-nm products, and therefore now the company’s management can confidently count on the appearance of the first 7-nm products of its own brand in 2023. This, by the way, does not dismiss the possibility of using the capacities of Intel contractors for the production of 7nm products. After 2023, as Patrick Gelsinger admitted, the company will annually present consistent improvements to existing technological processes, and this will also be a merit of the successful implementation of EUV lithography.
Speaking about the advantages of Intel’s new attempt to enter the contract services market, Gelsinger did not hide the fact that the location of the company’s facilities in the United States (and then in Europe) could be a decisive factor for some of the customers when choosing a contractor. At the same time, he calls for relying on all the advanced technologies in lithography and Intel’s intellectual property, which will be fully available to the company’s customers.
Intel claims a significant share of the contract services market, the capacity of which will reach $ 100 billion by 2025. Some enterprises will be optimized for the fulfillment of their own orders, some — for work with third-party customers, individual production lines will be able to flexibly reconfigure to meet operational needs. Intel already feels the support of the US and European authorities for the construction of new facilities in these regions, which will be built within two years.
Intel is open to cooperation with TSMC, Samsung Electronics, UMC and GlobalFoundries. Their common clients will be able to work on the same products with several contractors at once, and mutual competition will not become an obstacle to productive cooperation. Talking about the reasons for Intel’s past failures, the current head of the company mentioned both an excessive focus on internal ambition and a violation of performance discipline. In addition, Gelsinger noted that Intel’s developer tools have been isolated from the global ecosystem in recent years, and now the company is faced with the task of achieving greater interoperability with other market participants.